Asetek to Showcase Growing Adoption of OEM Solutions at SC15
OSLO, Norway, Nov. 12 -- Asetek today announced it will showcase its range of RackCDU hot water liquid cooling systems for HPC data centers at SC15 in Austin, TX November 16-19. Located at booth #1709, Asetek will showcase solutions from innovating and early adopting OEMs such as CIARA, Cray, Fujitsu, Format and Penguin.
HPC installations from around the world incorporating Asetek RackCDU D2C (Direct-to-Chip) technology, will also be featured. In addition, liquid cooling solutions for both current and future high wattage CPUs and GPUs from Intel, Nvidia and OpenPower will be on display.
“At SC15, the HPC community will have the opportunity to discover the value of Asetek’s technology as demonstrated by its growing list of installations and OEMs around the world,” said John Hamill, VP Worldwide Sales and Marketing. “Because liquid is 4,000 times better at storing and transferring heat than air, Asetek's solutions provide immediate and measurable benefits to large and small data centers alike, including reduced OpEx and CapEx and higher server density and performance.”
Asetek’s range includes RackCDU D2C (Direct-to-Chip), RackCDU ISAC (In-Server Air Conditioning), and Internal Loop Liquid Cooling. RackCDU D2C provides cooling energy savings greater than 50% and density increases of 2.5x-5x. RackCDU ISAC is a sealed server solution which captures over 90% of heat load into liquid and enables operation without concern for air quality. Internal Loop is liquid enhanced air cooling for server nodes that replaces less efficient air coolers and enables the servers to incorporate the highest performing CPUs and GPUs.
Appointments for in-depth discussions about Asetek’s data center liquid cooling solutions at SC15 may be scheduled by sending an email to questions@asetek.com.
About Asetek
Asetek is the world leading provider of energy efficient liquid cooling systems for data centers, servers, workstations, gaming and high performance PCs. Its products are used for reducing power and greenhouse emissions, lowering acoustic noise, and achieving maximum performance by leading OEMs and channel partners around the globe.
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Source: Asetek
