Covering Scientific & Technical AI | Sunday, January 12, 2025

ASRock Rack Reveals New OCP-Related Offering 

SANTA CLARA, Calif., March 7 -- The Open Compute Project (OCP) has been successfully reaching the goals of efficiency and scalability for 7 years. Since the demand for cloud services has skyrocketed, the OCP has become one of the best options to satisfy the hunger in the storage, datacenter, and virtual I/O areas. Therefore, ASRock Rack is proud to reveal a new optimized and flexible design.

ASRock Rack has developed the OCP series with Professional Power Usage (PUE), dual gigabit LAN ports and excellent I/O flexibility. Both support dual Intel Xeon E5-2600 v3 & v4 processors and a max 1024GB DDR4 memory capacity. This energy-efficient choice is eco-friendly and reduces the cost for computation-intensive applications. Built with dual Intel i210 GLAN controllers, this design makes sure the customer doesn’t need to purchase additional LAN cards. It creates more flexibility for deployments and the chance to minimize downtime by failover set-up. If this is still not enough, you’ll also find a Mezzanine slot (x8) which supports 10G Ethernet to amplify the bandwidth.

Furthermore, ASRock Rack has been busy creating cutting-edge designs of various mezzanine cards. Each card includes optimized development which enhances barebones & motherboards capacities. To view our squad and battleship, please visit ASRock Rack at Booth C7 at the OCP U.S. Summit 2017.


Source: ASRock Rack

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