Ceremorphic Tapes Out AI Supercomputing Chip on TSMC 5nm Node
SAN JOSE, Calif., Oct. 19, 2022 -- Ceremorphic Inc. today announced that it has successfully taped out its first 5nm chip with its partner TSMC. The solution delivers the performance required for next-generation applications such as AI model training, HPC, drug discovery and metaverse processing.
“Ceremorphic is the first company to tape out an AI supercomputing chip in the advanced 5nm process node, which represents a significant accomplishment for our company,” said Dr. Venkat Mattela, Founder and CEO of Ceremorphic. “Our hardware and software engineering teams have once again proven to be world-class and this design achievement positions us well for our next phase of growth and expansion.”
“With this announcement, the AI industry just got one step closer to finally addressing today’s critical challenges through reliable performance computing,” said Subhasish Mitra, Professor of Electrical Engineering and of Computer Science at Stanford University. “Congratulations to the entire Ceremorphic team for achieving this significant milestone and bringing a new level of innovation to the AI supercomputing community.”
About the Ceremorphic Architecture
The Ceremorphic chip contains reliable analog and digital circuits, very high speed (64Gbit, PCIe 6.0) and energy efficient connectivity circuits for system level and inter-node communications, multi-thread reliable processor and low power circuits for SoC silicon. This Hierarchical Learning Processor (HLP) deploys the right processing system for optimal power performance operation.
Key features of the chip include the following:
- Patented Multi-thread processing macro-architecture, ThreadArch based RISC–V processor for proxy processing (1GHz).
- Custom designed X16 PCIe 6.0 / CXL 3.0 connectivity interface.
- Reliability system components realized in advanced microarchitectures.
About Ceremorphic
Founded in April 2020, Ceremorphic currently has 150 full-time employees dedicated to developing advanced silicon and software products for next-generation computing systems. Leveraging more than 120 patents and proven expertise in creating industry-leading silicon system products, Ceremorphic has built a new architecture that delivers the performance needed for applications such as AI model training, automotive processing, drug discovery, HPC, and metaverse processing with unprecedented energy efficiency and reliability. Designed in advanced silicon technology node (TSMC 5nm), this architecture solves today’s high-performance computing problems in reliability, security and energy consumption across all performance-demanding market segments.
Source: Ceremorphic
