Happening Now
Tuesday, January 28- DOE Freezes All DEI-Related Activities, Removes PIER Criterion from Proposals
- Argonne Releases Aurora Exascale Supercomputer to Researchers
- UF Welcomes $24M in NVIDIA DGX Systems, Paving Way for Next-Gen HiPerGator AI 2.0
- NTT DATA Aims for $2B in Revenue with New Smart AI Agent by 2027
- Spectra Logic Introduces 24G Optical SAS Switch for Expanded Tape Connectivity
- UiPath Report Reveals Agentic AI Is Driving Investment to Tackle More Complex Business Workflows
- Applied Labs Raises $4.2M to Enhance AI Support and Ops Agents
- Earth AI Raises $20M for AI Driven Mineral Exploration
- Bodo.ai Open-Sources High Performance Python Compute Engine
- AWS and Booz Allen to Develop AI and Cloud Solutions for Government Innovation
- NVIDIA AI Helps Banks, Agencies, and Insurers Combat Fraud at Scale
- UC San Diego: Researchers Explore Neuromorphic AI’s Path to Efficiency and Scale
- DataRobot: Over Half of AI Leaders Plan to Augment Hyperscaler AI Investments
- BSC: ALIA Project Taps MareNostrum 5 to Build Europe’s Largest Public AI Model
- Pipeshift Secures $2.5M to Streamline Enterprise AI Deployment with Modular MLOps
- Cohere: How GenAI Can Streamline US Healthcare Operations
- Databricks Gains $15B in New Funding as Meta Joins Investor Roster
- SandboxAQ and Aramco Sign AI Agreement
- C3 AI and McKinsey Announce Strategic Alliance to Accelerate Enterprise-Scale AI Transformations
- DigitalOcean Launches GenAI Platform for Building AI Agents with 3rd Party Models
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Recent News
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Contributors
Tiffany TraderEditorial DirectorJamie HamptonManaging EditorKevin JacksonContributing EditorJohn RussellContributing EditorAlex WoodieContributing EditorDouglas EadlineContributing EditorAli AzharContributing EditorDrew JollyAssistant Editor
POLYN Introduces VibroSense, an Application-Specific Vibration Pre-Processing Chip Design
TEL AVIV, Israel, March 29, 2023 -- POLYN Technology today introduced VibroSense, a Tiny AI chip solution for vibration monitoring sensor nodes. VibroSense greatly reduces the amount of sensor ...Full Article
The Linux Foundation Announces Keynote Speakers for Open Source Summit North America 2023
SAN FRANCISCO, March 29, 2023 -- The Linux Foundation, the nonprofit organization enabling mass innovation through open source, today announced the keynote speakers for Open Source Summit North America, ...Full Article
Networking Chip Startup Enfabrica Emerges from Stealth Mode
MOUNTAIN VIEW, Calif., March 29, 2023 -- Enfabrica Corporation, a startup building leading-edge networking silicon and software tailored to the needs of fast-evolving Artificial Intelligence (AI) and accelerated computing ...Full Article
Cyxtera Launches Online Self-Service Capabilities for Its Global Data Center Platform
MIAMI, March 29, 2023 -- Cyxtera, a global leader in data center colocation and interconnection services, today announced new online self-service capabilities that allow organizations to evaluate, order, and ...Full Article
Synopsys.ai Unveiled as Industry’s 1st Full-Stack, AI-Driven EDA Suite for Chipmakers
SANTA CLARA, Calif., March 29, 2023 -- At its annual Synopsys Users Group (SNUG) Silicon Valley Conference, Synopsys, Inc. today launched Synopsys.ai, a suite of AI-driven solutions for the ...Full Article
IBM Cloud and Wasabi Partner to Power Data Insights Across Hybrid Cloud Environments
ARMONK, N.Y. and BOSTON, March 29, 2023 -- IBM and Wasabi Technologies, the hot cloud storage company, today announced they are collaborating to drive data innovation across hybrid cloud ...Full Article
Pega Announces Updates for Pega Cloud
CAMBRIDGE, Mass., March 28, 2023 -- Pegasystems Inc. today announced updates to Pega Cloud supported by an enhanced Global Operations Center to deliver a more scalable, reliable, and secure ...Full Article
FedML Secures $6M to Create ‘Collaborative AI’ for Large-Scale AI Training, Deployment and Customization
SUNNYVALE, Calif., March 28, 2023 -- FedML today announced $6 million in funding to spearhead a “collaborative AI” movement that empowers companies and developers to work together on machine ...Full Article
Imec Announces 2023 Lifetime of Innovation Award Recipients
LEUVEN, Belgium, March 28, 2023 -- Imec, a world-leading research and innovation hub in nanoelectronics and digital technologies, is thrilled to announce that this year’s Lifetime of Innovation Award ...Full Article
NTT Releases Network OS Beluganos
TOKYO, March 28, 2023 -- NTT Corporation (NTT) has developed a network OS compatible with white-box devices, and NTT Advanced Technology Corporation (NTT-AT) will commercialize it through the release ...Full Article