Covering Scientific & Technical AI | Monday, December 23, 2024

CIQ and Rocky Linux Release Errata Subsystem as an Open Source RESF Project

RENO, Nev., Feb. 2, 2023 — Doubling down on its commitment to full open source reproducibility of the most current Rocky Linux bug fixes, security patches and feature enhancements, CIQ engineers ...Full Article

GridGain Systems Highlights Strong Growth in 2022

FOSTER CITY, Calif., Feb. 2, 2023 -- GridGain, provider of enterprise-grade in-memory computing software for high-performance applications, today shared details about the company’s continuing momentum as it helps companies ...Full Article

Linux Foundation Energy Announces New Events, Projects, and Initiatives to Accelerate the Energy Transition in 2023

SAN FRANCISCO, Calif., Feb. 2, 2023 -- LF Energy, the open source foundation focused on harnessing the power of collaborative software and hardware technologies to decarbonize our global economies, ...Full Article

Fujitsu Deploys Its AI Demand Forecast Service for TORIDOLL Noodle Shops in Japan

TOKYO, Feb. 2, 2023 -- Fujitsu and TORIDOLL Holdings Corporation (hereinafter TORIDOLL Holdings) today announced the deployment of Fujitsu’s AI demand forecast service at 823 Marugame Udon noodle shops ...Full Article

Comet Announces Convergence 2023, Its 2nd Annual ML Conference

NEW YORK, Feb. 2, 2023 -- Comet today announced its second annual Convergence conference. The event, which is free to the ML community, will take place virtually March 7-8, ...Full Article

Rambus Delivers 6400 MT/s DDR5 Registering Clock Driver to Advance Server Memory Performance

SAN JOSE, Calif., Feb. 2, 2023 -- Rambus Inc., a premier chip and silicon IP provider making data faster and safer, has announced the availability of its new 6400 ...Full Article

Intel and UCSD Join DARPA Program to Prevent Exploitation of Computing Systems

Feb. 2, 2023 -- Intel and the University of California, San Diego (UC San Diego) have announced that they have been selected to join the Hardening Development Toolchains Against ...Full Article

UMC and Cadence Collaborate on 3D-IC Hybrid Bonding Reference Flow

HSINCHU, Taiwan and SAN JOSE, Calif., Feb. 1, 2023 -- United Microelectronics Corporation (UMC), a leading global semiconductor foundry, and Cadence Design Systems, Inc. today announced that the Cadence ...Full Article

The 37th AAAI Conference on Artificial Intelligence Announces 2023 Award Winners

WASHINGTON, Feb. 1, 2023 -- The Association for the Advancement of Artificial Intelligence (AAAI) has announced the winners of its 2023 awards that will be presented at the 37th Annual ...Full Article

TOPPAN FORMS Announces Selection of HPE GreenLake

TOKYO, Feb. 1, 2023 -- Hewlett Packard Enterprise has announced that TOPPAN FORMS CO., LTD., a leading global provider of data print services and business process outsourcing headquartered in ...Full Article
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