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Monday, March 10- ServiceNow Expands AI Agentic Capabilities with Moveworks Acquisition
- Utah Launches AI Education Initiative with NVIDIA to Expand Workforce Training
- LLNL Advances Code LLMs for HPC with DOE-Funded Research
- National Labs, Industry Host ‘Jam Session’ to Test AI Models
- LLNL Uses Machine Learning to Reveal Ice Surface Structure
- Giga Computing, SK Telecom, and SK Enmove Partner to Advance AI Data Centers and Liquid Cooling
- OSC Powers AI Image Processing for Smarter Farming Solutions
- Writer Accelerates Global Expansion to Meet International Demand for Agentic AI in the Enterprise
- H2O.ai Introduces Model Risk Management Framework for GenAI in Regulated Industries
- Trillion Parameter Consortium: EuroHPC Calls for Stronger AI Collaboration
- EuroHPC Supports DARE Project for Sovereign HPC and AI Development
- Axelera AI Lands €61.6M in EuroHPC Funding to Advance AI Chiplet Tech
- PEAK:AIO Expands AI Infrastructure with High-Density, Energy-Efficient 2U Server
- CoreWeave to Acquire Weights & Biases, Expanding MLOps Capabilities
- Ceramic.ai Launches to Deliver Faster and More Cost-Effective AI Model Training for Enterprises
- ACM Awards 2024 Turing Prize to Barto and Sutton for Reinforcement Learning Foundations
- Fluidstack and Eclairion to Deploy High-Density AI Supercomputer in France for Mistral AI
- Hammerspace Partners with Yition.ai to Advance AI Storage in China
- NVIDIA CEO Jensen Huang and Industry Leaders to Reveal AI’s Future at GTC 2025
- DeepL Unveils Clarify, Bringing AI-Driven Dialogue to Translation Services
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Recent News
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Contributors
Tiffany TraderEditorial DirectorJamie HamptonManaging EditorKevin JacksonContributing EditorJohn RussellContributing EditorAlex WoodieContributing EditorDouglas EadlineContributing EditorAli AzharContributing EditorDrew JollyAssistant Editor
KAUST Researchers Help Advance IoT Sustainability with Wirelessly Powered Devices
THUWAL, Saudi Arabia, Jan. 3, 2023 -- Emerging forms of thin-film device technologies that rely on alternative semiconductor materials, such as printable organics, nanocarbon allotropes and metal oxides, could ...Full Article
New NSF Program Seeks to Engage Minority Serving Institutions in AI Research
Dec. 30, 2022 -- The U.S. National Science Foundation — in collaboration with the U.S. Department of Homeland Security, Science and Technology Directorate; U.S Department of Agriculture, National Institute ...Full Article
TSMC Holds 3nm Volume Production and Capacity Expansion Ceremony
HSINCHU, Taiwan, Dec. 30, 2022 - TSMC has held a 3 nanometer (3nm) Volume Production and Capacity Expansion Ceremony at its Fab 18 new construction site in the Southern ...Full Article
Tredence Raises $175M in Series B Funding from Advent International
SAN JOSE | BOSTON | BANGALORE | MUMBAI, Dec. 23, 2022 -- Tredence, the Data Science and AI Solutions company, today announced it has raised USD 175 million in Series ...Full Article
Micron Reports Results for the First Quarter of Fiscal 2023
BOISE, Idaho, Dec. 22, 2022 — Micron Technology, Inc. (Nasdaq: MU) yesterday announced results for its first quarter of fiscal 2023, which ended December 1, 2022. Fiscal Q1 2023 highlights Revenue ...Full Article
Scale AI Named a 2022 Cool Vendor by Gartner
SAN FRANCISCO, Dec. 22, 2022 -- Scale AI has been named a Cool Vendor in the 2022 Gartner Cool Vendors in Data-Centric AI by Svetlana Sicular, Arun Chandrasekaran, Sumit Agarwal, ...Full Article
Supermicro Adds ARM-based Servers using Ampere Altra and Ampere Altra Max Processors Targeting Cloud-Native Applications
SAN JOSE, Calif., Dec. 21, 2022 — Supermicro, a total IT solution provider for cloud, AI/ML, storage, and 5G/edge, is announcing an expanded product line with exciting new ARM-based series ...Full Article
Robert Blair Joins Supermicro Board of Directors
SAN JOSE, Calif., Dec. 21, 2022 -- Supermicro, a Total IT Solution Provider for Cloud, AI/ML, Storage, and 5G/Edge, today announced the appointment of Robert Blair to the Board ...Full Article
Rescale Joins World Economic Forum Global Innovators Community
SAN FRANCISCO, Dec. 21, 2022 -- Rescale has announced that it has joined the World Economic Forum's (WEF) Global Innovators Community as part of the WEF Unicorn track. Rescale ...Full Article
Fujitsu and Tokai University Develop Ultrasound AI Tech for Food Safety
TOKYO and SHIZUOKA, Japan, Dec. 21, 2022 -- Tokai University and Fujitsu today revealed the successful development of a new technology to inspect the freshness of frozen tuna in ...Full Article