Happening Now
Friday, March 7- LLNL Advances Code LLMs for HPC with DOE-Funded Research
- National Labs, Industry Host ‘Jam Session’ to Test AI Models
- LLNL Uses Machine Learning to Reveal Ice Surface Structure
- Giga Computing, SK Telecom, and SK Enmove Partner to Advance AI Data Centers and Liquid Cooling
- OSC Powers AI Image Processing for Smarter Farming Solutions
- Writer Accelerates Global Expansion to Meet International Demand for Agentic AI in the Enterprise
- H2O.ai Introduces Model Risk Management Framework for GenAI in Regulated Industries
- Trillion Parameter Consortium: EuroHPC Calls for Stronger AI Collaboration
- EuroHPC Supports DARE Project for Sovereign HPC and AI Development
- Axelera AI Lands €61.6M in EuroHPC Funding to Advance AI Chiplet Tech
- PEAK:AIO Expands AI Infrastructure with High-Density, Energy-Efficient 2U Server
- CoreWeave to Acquire Weights & Biases, Expanding MLOps Capabilities
- Ceramic.ai Launches to Deliver Faster and More Cost-Effective AI Model Training for Enterprises
- ACM Awards 2024 Turing Prize to Barto and Sutton for Reinforcement Learning Foundations
- Fluidstack and Eclairion to Deploy High-Density AI Supercomputer in France for Mistral AI
- Hammerspace Partners with Yition.ai to Advance AI Storage in China
- NVIDIA CEO Jensen Huang and Industry Leaders to Reveal AI’s Future at GTC 2025
- DeepL Unveils Clarify, Bringing AI-Driven Dialogue to Translation Services
- TSMC Expands US Investment by $100B, Plans 3 New Fabs in Arizona
- VDURA Launches All-Flash NVMe V5000 to Power AI Factories and GPU Clouds
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Recent News
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Contributors
Tiffany TraderEditorial DirectorJamie HamptonManaging EditorKevin JacksonContributing EditorJohn RussellContributing EditorAlex WoodieContributing EditorDouglas EadlineContributing EditorAli AzharContributing EditorDrew JollyAssistant Editor
Quobyte Now Available in SUSE Rancher Apps Catalog
SANTA CLARA, Calif., Nov. 1, 2022 -- Quobyte Inc., the deploy-anywhere software storage provider, today announced it has joined the SUSE One Partner Program and is available in the ...Full Article
Object Management Group Wins NDIA Systems Engineering Excellence Group Award
BOSTON, Nov. 1, 2022 -- Today, international technology standards organization Object Management Group (OMG) announced that it had won the National Defense Industrial Association (NDIA) Lt General Thomas R. ...Full Article
HPE Introduces New HPE ProLiant Gen11 Servers
HOUSTON, Nov. 1, 2022 — Hewlett Packard Enterprise today announced a next-generation compute portfolio that delivers a cloud operating experience designed to power hybrid environments and digital transformation. The new HPE ProLiant Gen11 ...Full Article
atNorth Joins the WEKA Innovation Network
REYKJAVIK, Iceland, Nov. 1, 2022 -- atNorth, the leading pan-Nordic colocation, high performance computing and artificial intelligence service provider, has announced that it has joined the WEKA Innovation (WIN) ...Full Article
Tencent Cloud Named in 2022 Gartner Magic Quadrant for Cloud Infrastructure and Platform Services
HONG KONG, Oct. 31, 2022 -- Tencent Cloud today announced that it has been recognized as a Niche Player in the 2022 Gartner Magic Quadrant for Cloud Infrastructure and ...Full Article
IBM Tests Intellectual Property (IP) Analysis Tool with US Patent and Trademark Office
WASHINGTON, Oct. 31, 2022 -- IBM today announces a demonstration project with the U.S. Patent and Trademark Office (USPTO) to test an artificial intelligence (AI) driven intellectual property (IP) analysis ...Full Article
Ansys Announces the Launch of Ansys Gateway Powered by AWS
PITTSBURGH, Oct. 31, 2022 -- Ansys today announced availability of Ansys Gateway powered by Amazon Web Services (AWS), which allows customers to use popular Ansys products in one unique ...Full Article
Tencent Cloud Ranks Top 2 in China’s Public Cloud Service Market
HONG KONG, Oct. 28, 2022 — Tencent Cloud, the cloud business of global technology company Tencent, today announced that it continues to rank in second place in China with ...Full Article
NSF Announces $10M Partnership with Micron to Support Semiconductor Design and Manufacturing
Oct. 28, 2022 — The U.S. National Science Foundation today announced a cross-sector partnership with Micron Technology, Inc. to develop bold, potentially transformative solutions to address semiconductor manufacturing challenges ...Full Article
Ansys Multiphysics Solutions Achieve Certification for TSMC N4 Process and FINFLEX Architecture
PITTSBURGH, Oct. 28, 2022 — Ansys and TSMC continue their long-standing technology collaboration to announce certification of Ansys’ power integrity software for TSMC’s FINFLEX innovation as well as the TSMC N4 process. TSMC’s FINFLEX architecture ...Full Article