Happening Now
Friday, March 7- LLNL Advances Code LLMs for HPC with DOE-Funded Research
- National Labs, Industry Host ‘Jam Session’ to Test AI Models
- LLNL Uses Machine Learning to Reveal Ice Surface Structure
- Giga Computing, SK Telecom, and SK Enmove Partner to Advance AI Data Centers and Liquid Cooling
- OSC Powers AI Image Processing for Smarter Farming Solutions
- Writer Accelerates Global Expansion to Meet International Demand for Agentic AI in the Enterprise
- H2O.ai Introduces Model Risk Management Framework for GenAI in Regulated Industries
- Trillion Parameter Consortium: EuroHPC Calls for Stronger AI Collaboration
- EuroHPC Supports DARE Project for Sovereign HPC and AI Development
- Axelera AI Lands €61.6M in EuroHPC Funding to Advance AI Chiplet Tech
- PEAK:AIO Expands AI Infrastructure with High-Density, Energy-Efficient 2U Server
- CoreWeave to Acquire Weights & Biases, Expanding MLOps Capabilities
- Ceramic.ai Launches to Deliver Faster and More Cost-Effective AI Model Training for Enterprises
- ACM Awards 2024 Turing Prize to Barto and Sutton for Reinforcement Learning Foundations
- Fluidstack and Eclairion to Deploy High-Density AI Supercomputer in France for Mistral AI
- Hammerspace Partners with Yition.ai to Advance AI Storage in China
- NVIDIA CEO Jensen Huang and Industry Leaders to Reveal AI’s Future at GTC 2025
- DeepL Unveils Clarify, Bringing AI-Driven Dialogue to Translation Services
- TSMC Expands US Investment by $100B, Plans 3 New Fabs in Arizona
- VDURA Launches All-Flash NVMe V5000 to Power AI Factories and GPU Clouds
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Recent News
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Contributors
Tiffany TraderEditorial DirectorJamie HamptonManaging EditorKevin JacksonContributing EditorJohn RussellContributing EditorAlex WoodieContributing EditorDouglas EadlineContributing EditorAli AzharContributing EditorDrew JollyAssistant Editor
Ansys 3D-IC Power Integrity and Thermal Solutions Certified for TSMC 3Dblox Reference Flow
PITTSBURGH, Oct. 27, 2022 -- Ansys has collaborated with TSMC to certify that Ansys RedHawk-SC and Ansys Redhawk-SC Electrothermal are compliant with TSMC's 3Dblox standard for the exchange of ...Full Article
AWS Announces Amazon Neptune Serverless
SEATTLE, Oct. 27, 2022-- Amazon Web Services, Inc. (AWS) has announced Amazon Neptune Serverless, a new serverless option for Amazon Neptune that automatically scales to support unpredictable and business-critical ...Full Article
Silicon Data Awards 2022: Kalray Wins Several Awards with Its DPU Processor
GRENOBLE, France, Oct. 27, 2022 -- Kalray, a leading provider of hardware and software technologies for high-performance, data-centric computing markets has won several awards, including the Gold Innovation Award, ...Full Article
Schmidt Futures Announces UCSD as Partner of $148M Initiative Accelerating Scientific AI Use
Oct. 27, 2022 -- The University of California San Diego has been selected to join the Eric and Wendy Schmidt AI in Science Postdoctoral Fellowship, a program of Schmidt ...Full Article
LatticeFlow Secures $12M to Eliminate AI Data and Model Blind Spots in Computer Vision
Oct. 27, 2022 -- LatticeFlow, the only artificial intelligence (AI) platform that can automatically find and fix AI data and model errors, has announced a $12 million Series A ...Full Article
Fujitsu Announces Digital Collaboration with WBCSD for Carbon Neutral Transportation
TOKYO, Oct. 26, 2022 -- Fujitsu today announced the start of a digital collaboration with the World Business Council for Sustainable Development (WBCSD), Dutch consulting firm Arcadis and British ...Full Article
Midwestern Higher Education Compact Selects Dell APEX for Digital Experiences in Higher Ed
ROUND ROCK, Texas, Oct. 26, 2022 -- Midwestern Higher Education Compact (MHEC) has selected Dell Technologies to deliver a platform, including the Dell APEX portfolio of as-a-Service solutions, that helps ...Full Article
NEC Awarded Bronze Badge for 5G Open RAN Radio Units in Latest Published TIP Requirements 2.1
TOKYO, Oct. 26, 2022 -- NEC Corporation has been awarded a Bronze Badge from the Telecom Infra Project (TIP), this time for complying with the requirements for TIP's OpenRAN RU ...Full Article
Tachyum Unveils Flattened Networking for Prodigy Exascale Supercomputers
LAS VEGAS, Oct. 26, 2022 – Tachyum today unveiled a high-performance, low-latency, low-cost and low-power, highly scalable exascale flattened networking solution that provides a superior alternative to the more expensive, ...Full Article
Systel Announces Strategic OEM Partnership with Hewlett Packard Enterprise
SUGAR LAND, Texas, Oct. 26, 2022 -- Systel, Inc. has announced a strategic OEM partnership with Hewlett Packard Enterprise (HPE) to offer rugged leading-edge computing technologies and solutions to ...Full Article