Happening Now
Monday, February 10- AMD and G42 to Enable AI Innovation in France Through Strategic Investments
- Texas A&M System Triples AI Supercomputing Capacity
- SandboxAQ Expands Alliance with Deloitte to Offer AI Simulation Software Solutions
- AMD and G42 to Enable AI Innovation in France Through Strategic Investments
- Nokia Announces Leadership Transition, Justin Hotard to Take Over as CEO
- Fluidstack to Build 1GW AI Supercomputer in France
- MOSTLY AI Unveils Open-Source Toolkit for Synthetic Data Generation
- Pecan AI Launches AI-Driven Co-Pilot for Predictive Analytics, Expanding Access to ML
- Sandia Deploys Private ChatGPT Instance for Secure Employee Use
- European Union: First Rules of the Artificial Intelligence Act Are Now Applicable
- Oracle Recognized as a Leader in the 2025 IDC MarketScape
- Cognida.ai Secures $15M Series A from Nexus Venture Partners
- TrueFoundry Secures $19 Million Series A Funding to Transform AI Deployment
- NVIDIA’s Spectrum-X Enhances AI Storage Bandwidth by Up to 48%
- Armada Expands Edge AI in Saudi Arabia with Aramco Digital and Microsoft
- Supermicro Ramps Full Production of NVIDIA Blackwell Rack-Scale Solutions with NVIDIA HGX B200
- Altair Enhances HPCWorks with AI-Driven Scheduling and Cloud Scaling
- Alluxio Enhances Enterprise AI with Version 3.5 for Faster Model Training
- Krutrim Secures $230M for AI Research in India, Launches New Frontier Lab
- UMD Study: AI Jobs Rise While Overall US Hiring Declines
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Contributors
Tiffany TraderEditorial DirectorJamie HamptonManaging EditorKevin JacksonContributing EditorJohn RussellContributing EditorAlex WoodieContributing EditorDouglas EadlineContributing EditorAli AzharContributing EditorDrew JollyAssistant Editor
CXL Consortium and JEDEC Sign MOU Agreement to Advance DRAM and Persistent Memory Technology
Aug. 24, 2022 — JEDEC Solid State Technology Association and Compute Express Link (CXL) Consortium today announced the signing of a Memorandum of Understanding (MOU) to formalize collaboration between the two organizations. The ...Full Article
Sylabs and Anchore Collaborate to Bring SBOM Support for Singularity Containers
RENO, Nev., Aug. 24, 2022 — Sylabs, a global leader in providing container technology and services for performance-intensive workloads, today announced that it has collaborated with Anchore to bring ...Full Article
QpiAI Announces AI-Enabled QpiAISense Platform
MILPITAS, Calif. and BENGALURU, India, Aug. 24, 2022 -- QpiAI, a leader in quantum computing and AI, today announced QpiAISense platform for room temperature qubit control. QpiAISense accelerates ML ...Full Article
Loft Labs Announces DevSpace Version 6
SAN FRANCISCO, Aug. 24, 2022 -- Loft Labs, provider of developer tooling and multi-tenancy solutions for Kubernetes, today announced DevSpace version 6, open-source software for Kubernetes that enables users ...Full Article
Seeed Studio Joins Nvidia Metropolis
SHENZHEN, China, Aug. 24, 2022 -- Seeed Studio, a provider of AIoT Hardware Service Platform, today announced it has joined NVIDIA Metropolis, a partner program focused on bringing to ...Full Article
Ansys Adopts AMD MI200 Instinct Accelerators
PITTSBURGH, Aug. 24, 2022 -- Ansys today announced that Ansys Mechanical is one of the first commercial finite element analysis (FEA) programs supporting AMD Instinct accelerators, the newest data ...Full Article
Lightmatter Names TPU Engineer Richard Ho as VP of Hardware Engineering
BOSTON, Aug. 23, 2022 — Lightmatter, a leader in photonic computing, has named its new Vice President of Hardware Engineering, Richard Ho, who spent nearly 9 years at Google leading ...Full Article
Fabio Vernillo from Avanea Joins Tachyum Board of Observers
LAS VEGAS, Aug. 23, 2022 – Tachyum today announced that it has formed a Board of Observers with Fabio Vernillo, head of investments for Avanea, as its first member. Avanea is ...Full Article
RAID Inc. Announces 20TB HDDs Fully Qualified for Ability 84-Bay and 106-Bay EBODs
LAWRENCE, Mass., Aug. 23, 2022 -- RAID Incorporated, a leader in designing and implementing customized high-performance storage solutions for HPC, big data, cloud, and software-defined data centers, today announced ...Full Article
Intel Announces Semiconductor Co-Investment Program to Help Fund Manufacturing Build-outs
SANTA CLARA, Calif., Aug. 23, 2022 – Intel Corporation today announced a first-of-its-kind Semiconductor Co-Investment Program (SCIP) that introduces a new funding model to the capital-intensive semiconductor industry. As part of ...Full Article