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Monday, March 10- ServiceNow Expands AI Agentic Capabilities with Moveworks Acquisition
- Utah Launches AI Education Initiative with NVIDIA to Expand Workforce Training
- LLNL Advances Code LLMs for HPC with DOE-Funded Research
- National Labs, Industry Host ‘Jam Session’ to Test AI Models
- LLNL Uses Machine Learning to Reveal Ice Surface Structure
- Giga Computing, SK Telecom, and SK Enmove Partner to Advance AI Data Centers and Liquid Cooling
- OSC Powers AI Image Processing for Smarter Farming Solutions
- Writer Accelerates Global Expansion to Meet International Demand for Agentic AI in the Enterprise
- H2O.ai Introduces Model Risk Management Framework for GenAI in Regulated Industries
- Trillion Parameter Consortium: EuroHPC Calls for Stronger AI Collaboration
- EuroHPC Supports DARE Project for Sovereign HPC and AI Development
- Axelera AI Lands €61.6M in EuroHPC Funding to Advance AI Chiplet Tech
- PEAK:AIO Expands AI Infrastructure with High-Density, Energy-Efficient 2U Server
- CoreWeave to Acquire Weights & Biases, Expanding MLOps Capabilities
- Ceramic.ai Launches to Deliver Faster and More Cost-Effective AI Model Training for Enterprises
- ACM Awards 2024 Turing Prize to Barto and Sutton for Reinforcement Learning Foundations
- Fluidstack and Eclairion to Deploy High-Density AI Supercomputer in France for Mistral AI
- Hammerspace Partners with Yition.ai to Advance AI Storage in China
- NVIDIA CEO Jensen Huang and Industry Leaders to Reveal AI’s Future at GTC 2025
- DeepL Unveils Clarify, Bringing AI-Driven Dialogue to Translation Services
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Recent News
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Contributors
Tiffany TraderEditorial DirectorJamie HamptonManaging EditorKevin JacksonContributing EditorJohn RussellContributing EditorAlex WoodieContributing EditorDouglas EadlineContributing EditorAli AzharContributing EditorDrew JollyAssistant Editor
Loft Labs Announces DevSpace Version 6
SAN FRANCISCO, Aug. 24, 2022 -- Loft Labs, provider of developer tooling and multi-tenancy solutions for Kubernetes, today announced DevSpace version 6, open-source software for Kubernetes that enables users ...Full Article
Seeed Studio Joins Nvidia Metropolis
SHENZHEN, China, Aug. 24, 2022 -- Seeed Studio, a provider of AIoT Hardware Service Platform, today announced it has joined NVIDIA Metropolis, a partner program focused on bringing to ...Full Article
Ansys Adopts AMD MI200 Instinct Accelerators
PITTSBURGH, Aug. 24, 2022 -- Ansys today announced that Ansys Mechanical is one of the first commercial finite element analysis (FEA) programs supporting AMD Instinct accelerators, the newest data ...Full Article
Lightmatter Names TPU Engineer Richard Ho as VP of Hardware Engineering
BOSTON, Aug. 23, 2022 — Lightmatter, a leader in photonic computing, has named its new Vice President of Hardware Engineering, Richard Ho, who spent nearly 9 years at Google leading ...Full Article
Fabio Vernillo from Avanea Joins Tachyum Board of Observers
LAS VEGAS, Aug. 23, 2022 – Tachyum today announced that it has formed a Board of Observers with Fabio Vernillo, head of investments for Avanea, as its first member. Avanea is ...Full Article
RAID Inc. Announces 20TB HDDs Fully Qualified for Ability 84-Bay and 106-Bay EBODs
LAWRENCE, Mass., Aug. 23, 2022 -- RAID Incorporated, a leader in designing and implementing customized high-performance storage solutions for HPC, big data, cloud, and software-defined data centers, today announced ...Full Article
Intel Announces Semiconductor Co-Investment Program to Help Fund Manufacturing Build-outs
SANTA CLARA, Calif., Aug. 23, 2022 – Intel Corporation today announced a first-of-its-kind Semiconductor Co-Investment Program (SCIP) that introduces a new funding model to the capital-intensive semiconductor industry. As part of ...Full Article
The Kraft Group Taps Dell Technologies for IT Operations
ROUND ROCK, Texas and FOXBOROUGH, Mass., Aug. 23, 2022 -- The Kraft Group – a holding company with diverse interests that include the New England Patriots, New England Revolution ...Full Article
Talend Named a Leader in 2022 Gartner Magic Quadrant for Data Integration Tools
SAN MATEO, Calif., Aug. 23, 2022 -- Talend, a global leader in data integration and data management, has announced it has once again been named by Gartner, Inc. as a Leader ...Full Article
Intel Highlights Latest Innovations at Hot Chips 34
Aug. 23, 2022 — At Hot Chips 34, Intel highlights the latest architectural and packaging innovations enabling the 2.5D and 3D tile-based chip designs that will bring about a new era ...Full Article