Happening Now
Thursday, January 9- BrainChip Unveils Edge AI Box Partner Ecosystem Spanning AI and Embedded Solutions
- Hammerspace and Cloudian Partner to Enable Exabyte-Scale Data Management Across Clouds
- Dataiku Unveils 2025 GenAI Trends Report
- New Jersey Innovation Institute Launches New Division to Help Businesses Harness AI
- Supermicro Begins Volume Shipments of Max-Performance Servers with Intel Xeon 6900 Processors
- DDN Receives $300M to Scale AI Infrastructure and HPC Solutions
- AI and Big Data Expo Global Set for February 5-6, 2025, at Olympia London
- NVIDIA Unveils Blueprints to Power AI Query Engines for Enterprises
- AIC and Unigen Showcase the EB202-CP-UG Edge AI Inference Solution at CES 2025
- Centific Integrates NVIDIA AI Blueprint to Advance Video Analytics Across Industries
- JEDEC Announces Updates to Universal Flash Storage and Memory Interface Standards
- NVIDIA and Partners Launch Agentic AI Blueprints to Automate Work for Every Enterprise
- Uber Teams Up with NVIDIA to Accelerate Autonomous Mobility
- Ambi Robotics Deploys Vertically-integrated AI Foundation Model for Warehouse Robots
- Numenta Creates Independent Nonprofit with Thousand Brains Project to Advance AI Research
- 18 New Semiconductor Fabs to Start Construction in 2025, SEMI Reports
- NVIDIA Unveils Project DIGITS Personal AI Supercomputer
- IBM Study: AI Spending Expected To Surge 52 Percent Beyond IT Budgets
- GIGABYTE Launches New Servers with NVIDIA HGX B200 Platform for AI and HPC
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Recent News
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Contributors
Tiffany TraderEditorial DirectorJamie HamptonManaging EditorKevin JacksonContributing EditorJohn RussellContributing EditorAlex WoodieContributing EditorDouglas EadlineContributing EditorAli AzharContributing EditorDrew JollyAssistant Editor
Algorithmia Launches Teams Edition
SEATTLE, Aug. 25, 2020 — Algorithmia announces Teams, a new version of its platform designed for small groups within organizations that want the performance of an enterprise-grade MLOps platform ...Full Article
ThoughtSpot Introduces DataFlow to Leverage All Enterprise Data
SUNNYVALE, Calif., Aug. 25, 2020 — ThoughtSpot has long recognized that business users need quick, easy access to data to gather insights that inform decisions whenever and wherever they’re made. Critical ...Full Article
Redis Labs Raises $100M from Bain Capital Ventures and TCV
MOUNTAIN VIEW, Calif., August 25, 2020—Redis Labs announced it has closed $100 million in Series F financing at a company valuation of more than $1 billion. This investment was co-led ...Full Article
Appen Partners with World Economic Forum to Create Responsible AI Standards
SAN FRANCISCO, Aug. 25, 2020 -- Appen, provider of high-quality training data for machine learning systems, has partnered with the World Economic Forum to design and release standards and ...Full Article
Synopsys Collaborates with TSMC to Accelerate 3nm Innovation, Enabling Next-Gen SoC Design
MOUNTAIN VIEW, Calif., Aug. 25, 2020 — Synopsys, Inc. announced that TSMC has certified Synopsys’ digital and custom design platforms for TSMC’s 3-nanometer (nm) process technology. This certification, based on TSMC’s latest ...Full Article
AWS Announces General Availability of Amazon EBS io2 Volume
SEATTLE, Aug. 25, 2020 — Amazon Web Services, Inc., (AWS), an Amazon Company, announced the general availability of io2, the next generation Provisioned IOPS SSD volumes for Amazon Elastic ...Full Article
Ansys Achieves Certification of its Multiphysics Solutions for TSMC’s 3nm Process Technology
PITTSBURGH, Aug. 25, 2020 — Ansys achieved certification of its state-of-the-art multiphysics signoff solution for TSMC’s most advanced 3nm process technology. This enables mutual customers to satisfy key power, thermal and reliability requirements ...Full Article
QCI Appoints Former Boeing Executive, James B. Davis, to Technical Advisory Board
LEESBURG, Va., Aug. 25, 2020 — Quantum Computing Inc. has appointed former Boeing vice president and manufacturing operations expert, James B. Davis, to its technical advisory board. Davis brings to the ...Full Article
Synopsys and TSMC Accelerate 2.5D/3DIC Designs with CoWoS-S and Integrated Fan-Out Certified Design Flows
MOUNTAIN VIEW, Calif., Aug. 25, 2020 — Synopsys, Inc. announced that Synopsys and TSMC have collaborated to deliver certified design flows for advanced packaging solutions using the Synopsys 3DIC Compiler product for both silicon interposer ...Full Article
Marvell and TSMC Collaborate to Deliver Data Infrastructure Portfolio on 5nm Technology
SANTA CLARA, Calif., Aug. 25, 2020 – Marvell, provider of data infrastructure semiconductor solutions, announced an extension of their long term partnership with TSMC, a dedicated semiconductor foundry, to ...Full Article